Low dielectric fine foamed resin material suitable for radomes for 5G communication devices.
古河電気工業 機能樹脂エンジニアリング営業部
In 5G/6G, the introduction of a large number of communication devices that handle high-frequency radio waves will lead to issues such as securing installation locations for communication devices, increased power consumption, and increased heat generation from antenna substrates. By utilizing our unique ultra-fine foamed resin material (MCP), we can expect an extension of the installation intervals for communication devices, improved flexibility in installation locations due to weight reduction, reduced power consumption, and enhanced freedom in thermal design of the equipment. 【Features of Ultra-Fine Foamed Resin (MCP)】 1. By foaming a low-dielectric resin material, the material's relative permittivity Dk and dielectric loss tangent Df decrease, leading to further improvement in radio wave transmission. In particular, our unique ultra-fine foamed resin (MCP) can form bubbles in the micrometer size range, providing good radio wave transmission even for high-frequency radio waves. 2. Foaming reduces the material density, resulting in a lightweight material. 3. In foamed resin materials, light is reflected at the interface between the resin and the bubbles. Particularly with our unique ultra-fine foamed resin (MCP), by making the bubble diameter fine, light reflection is repeated near the material surface, suppressing light transmission into the material and demonstrating excellent light reflectivity. It shows high reflectivity not only in the visible light range but also in the infrared range, making it less susceptible to the effects of radiative heat, and thus it is expected to have an effect as a heat-insulating panel.
