TST Wafer Supply Taping Device
Introduction of the automatic taping device for wafer ring supply type electrical appearance inspection!
We would like to introduce the "TST Wafer Supply Taping Device" that we handle. This device cuts out wafer-level CSP or substrate-type MCMs, which are attached to an 8-inch wafer ring, one by one using a picker unit. After performing electrical testing and visual inspection, it automatically carries out taping. The electrical testing is customizable (including O/S function tests, withstand voltage tests, etc.), and the taping is done using embossed taping. 【Specifications (partial)】 ■ Supply form: 8-inch wafer ring ■ Supply method: 8-inch wafer cassette for 25 pieces ■ Picker method: bottom push-up, top suction PP transport ■ Electrical testing: customizable (including O/S function tests, withstand voltage tests, etc.) *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Other Specifications】 ■Appearance Inspection - Bottom surface (terminal shape, inspection for large chips and cracks, etc.) - In-pocket (direction, front and back confirmation, text inspection, etc.) ■Taping: Embossed Taping *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
