We would like to express our sincere gratitude for your exceptional support. The Glass Foam Material Business Cooperative will be exhibiting at the 8th International Construction and Surveying Exhibition (CSPI2026), and we would like to provide you with the following information. The International Construction and Surveying Exhibition (CSPI2026) will contribute to the development of the construction and surveying industry while addressing industry challenges, improving the environment, and enhancing productivity. We hope to showcase our lightweight fill material "Super Sol," allowing you to experience its wide range of applications and benefits firsthand. We will also present representative examples of lightweight fill in a diorama for clearer understanding. We understand you are busy, but we sincerely hope you will take this opportunity to visit us. 【Event Overview】 Exhibition Name: 8th International Construction and Surveying Exhibition (CSPI2026) Date and Time: June 17, 2026 (Wednesday) 10:00 AM – 5:00 PM June 18, 2026 (Thursday) 10:00 AM – 5:00 PM June 19, 2026 (Friday) 10:00 AM – 5:00 PM June 20, 2026 (Saturday) 10:00 AM – 4:00 PM

Technical Seminar on Lightweight Fill Method and Glass Foam Recycled Materials [Program] 1. Lightweight Fill Method (1) What is lightweight fill material? (2) Data on lightweight fill materials (3) Scope of application (4) Construction achievements (5) Workability 2. Glass Foam Recycled Materials (1) What are glass foam recycled materials? (2) Features (3) Design soil parameters (4) Considerations for design and construction (5) Application examples On June 5, 2026 (Friday), a technical seminar on "Lightweight Fill Method and Glass Foam Recycled Materials" will be held at "Denka Big Swan Stadium, Conference Room 4," located at 67-12 Kiyogoro, Chuo Ward, Niigata City, Niigata Prefecture, as a CPD accredited program by the Japan Society of Civil Engineers (2.7 units). Registration is limited to the first 60 participants, so please apply early. For details and registration, please refer to the attached file.